Processing equipment:
 

Sputtering equipment (home made)	evaporator Metal evaporation equipment	Home made plasma etcher  for fluorine containing gases
Home made plasma etcher  for chlorine containing gases	Rapid thermal annealing and  oxidation furnace with  halogen lamps	Conventional furnaces
LPCVD system for polysilicon  and silicon nitride deposition	Electron beam lithography equipment	Optical lithography  contact aligner 1
Optical lithography  contact aligner 2	Lithography Facility	TEOS-PECVD
Wet bench 1  (Device Manufacturing)	Wet bench 2  (for MEMS)	Wet bench 3  (for MEMS)
	Au Evaporation

Analysis techniques:
 

Scanning Electron Microscopy (SEM)	X-Ray Diffraction (XRD)	Secondary Ion Mass Spectrometry (SIMS)
Total X-Ray Reflection Fluorescence Analysis (TXRFA)	Thin film stress measurement system	Elipsometry
Profilometry	Roughness measurement by laser light scattering	I - V and C - V measurement stations
Four-point probe analysis	Optical microscopy	Curve Tracer
Fourier Transform Infrared Spectroscopy (FTIRS)	Rutherford Backscattering Spectrometry (RBS)

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